Before the U.S. export rules were modified, Huawei successfully sourced 5nm Kirin 9000 APs for the Mate 40 series back in 2020.
Rumors and speculations about SMIC and Huawei’s progress in creating 5nm chips through the use of older deep ultraviolet lithography machines have been circulating. A tweet originating from an “X” subscriber by the handle @jasonwill101, as reported by Wccftech, hinted at SMIC’s completion of the taping out phase for their 5nm chips. This crucial milestone signifies a shift from chip design to production, marking a significant achievement for both Chinese entities.
Looking ahead, it is anticipated that SMIC will impose higher costs on Huawei for its 5nm production due to the challenges associated with utilizing the DUV machine. While strides have been made towards achieving 5nm chip production, the looming question remains: how will they progress to 3nm and beyond in the absence of access to an EUV machine?
Huawei’s patent application for self-aligned quadruple patterning (SAQP) lithography hints at a potential avenue to acquire 3nm chips. Nevertheless, top-tier foundries such as TSMC and Samsung Foundry are already set to advance to the 2nm technology by the latter half of 2025.
As the third-largest foundry globally after TSMC and Samsung, if SMIC achieves the development of 5nm chipsets by 2024, consumers may expect their debut on Huawei’s Mate 70 series later in the current year.
Additional Facts:
– SMIC, also known as Semiconductor Manufacturing International Corporation, is a Chinese semiconductor foundry based in Shanghai, China.
– The company was founded in 2000 and has grown to become one of the leading semiconductor foundries globally, offering services from 0.35-micron to 14-nanometer process technologies.
– SMIC has faced challenges in catching up with more advanced foundries like TSMC and Samsung in terms of production capabilities and technology nodes due to restrictions on equipment and technologies imposed by the U.S. government.
Key Questions:
1. How will the relationship between Huawei and SMIC impact the global semiconductor industry, particularly in the race towards more advanced chipsets like 5nm and beyond?
2. What strategies will SMIC implement to overcome technological challenges and meet the demand for cutting-edge chip manufacturing?
3. How will geopolitical tensions and export regulations affect the development and accessibility of advanced chip technologies for Chinese companies like Huawei and SMIC?
Advantages and Disadvantages:
– Advantages:
– Localization of semiconductor manufacturing in China reduces dependency on foreign suppliers.
– Collaboration between Huawei and SMIC may foster indigenous innovation and strengthen China’s semiconductor industry.
– Advancements in 5nm chip production can enhance the performance and efficiency of electronic devices.
– Disadvantages:
– Technological limitations and lack of access to EUV machines may hinder the rapid progression beyond 5nm technology.
– Compliance with export rules and restrictions may pose challenges in acquiring essential equipment and intellectual property for semiconductor production.
– Competition from established foundries like TSMC and Samsung could impact the market penetration and adoption of SMIC’s chipsets.
Suggested Related Links:
– SMIC Official Website
– Huawei Official Website