Michał NawrockiIn the world of smartphones, Google’s Pixel lineup has always been known for its impressive design and user-friendly interface. However, when it comes to the performance of its internal components, Google has often fallen short. The previous iteration, Tensor G3, failed to meet expectations, leaving users disappointed. As we eagerly await the release of the Tensor G4 to power the upcoming Pixel 9 and Pixel 9 Pro, the question on everyone’s mind is whether Google will finally turn things around.
One thing that is clear is that Google is likely to continue its partnership with Samsung’s foundry for the Tensor G4. Despite Samsung not having the best track record compared to TSMC, Google’s decision is driven by the need for the best pricing, considering its lower smartphone shipment volume compared to industry giants like Apple. The Tensor G4 is expected to leverage Samsung’s 4nm LPP+ node, which is also utilized in the production of the Exynos 2400, found in select Samsung Galaxy S24 models.
The utilization of the Exynos 2400 chip could bring significant improvements to the Tensor G4. Google might also take advantage of Samsung’s ‘Fan-out Wafer Level Packaging’ (FOWLP) technology, which enhances heat resistance, thereby improving thermals and multi-core performance. This could address the temperature issues faced by its predecessor, the Tensor G3, during demanding tasks.
However, early benchmark leaks suggest a different story. The Tensor G4 seems to have a different configuration than the Exynos 2400 and exhibits disappointing single-core and multi-core performance. In fact, it appears to be 19 percent slower than its predecessor. The leaked benchmarks also reveal that both the Tensor G4 and G3 share the same GPU, implying potentially zero improvements in graphics performance for the upcoming Pixel 9 series.
While Google’s silicon division aims to rival its competitors, the current leaks are discouraging. It raises concerns about Google’s commitment to delivering a high-performance chipset. A poorly performing Tensor G4 could result in harsh criticism and a dent in Google’s reputation among enthusiasts. This might push regular consumers to consider alternatives, such as iPhones, where performance is often prioritized.
Nevertheless, if the Tensor G4 manages to incorporate some of the capabilities of the Exynos 2400, it could be a game changer for Google. As we eagerly anticipate the release, only time will tell if Google’s latest iteration will live up to its promise.
FAQ:
1. What is the previous iteration of the Pixel lineup?
– The previous iteration of the Pixel lineup is the Tensor G3.
2. What has been a common criticism of Google’s smartphones?
– Google’s smartphones have often been criticized for their performance.
3. Which company is likely to continue its partnership with Google for the Tensor G4?
– Google is likely to continue its partnership with Samsung’s foundry for the Tensor G4.
4. Why did Google choose Samsung’s foundry for the Tensor G4?
– Google chose Samsung’s foundry for the Tensor G4 due to the need for competitive pricing and its lower smartphone shipment volume compared to industry giants like Apple.
5. What technology from Samsung might Google take advantage of for the Tensor G4?
– Google might take advantage of Samsung’s ‘Fan-out Wafer Level Packaging’ (FOWLP) technology for the Tensor G4.
6. What issues did the predecessor, the Tensor G3, face?
– The Tensor G3 faced temperature issues during demanding tasks.
7. What do early benchmark leaks suggest about the Tensor G4’s performance?
– Early benchmark leaks suggest that the Tensor G4 has disappointing single-core and multi-core performance and is 19 percent slower than its predecessor.
8. What is the potential impact of a poorly performing Tensor G4 on Google’s reputation?
– A poorly performing Tensor G4 could result in harsh criticism and damage Google’s reputation among enthusiasts, potentially pushing regular consumers to consider alternatives such as iPhones.
9. How might the capabilities of the Exynos 2400 benefit the Tensor G4?
– The capabilities of the Exynos 2400 could bring significant improvements to the Tensor G4, especially in terms of thermals and multi-core performance.
10. Will the Tensor G4 live up to its promise?
– Only time will tell if the Tensor G4 will live up to its promise. We will have to wait for its release to know for sure.
Definitions:
– Tensor G3: The previous iteration of Google’s smartphone chipset, known for its underwhelming performance.
– Tensor G4: The upcoming iteration of Google’s smartphone chipset expected to power the Pixel 9 and Pixel 9 Pro.
– Exynos 2400: A chip produced by Samsung and potentially utilized in the Tensor G4, known for its capabilities.
– 4nm LPP+ node: Refers to Samsung’s 4nm low power plus (LPP+) process node used for semiconductor manufacturing, which is likely to be used in the production of the Tensor G4.
– Fan-out Wafer Level Packaging (FOWLP): A packaging technology developed by Samsung that provides better heat resistance and can improve thermals and multi-core performance of a chip.
Suggested Related Links:
– google.com
– apple.com
The source of the article is from the blog procarsrl.com.ar
